Komatsu

Wafer inspection equipment

رقم القطعة: KOMATSU-WAFER-INSPECTION-EQUIPMENT

لا يعرض أي بائع سعرًا لهذا المنتج بعد.

للطلب والدفع استخدم تطبيق ENG.

الوصف

Wafer inspection equipment

المواصفات

FunctionCrack detection, stain detection
ProcessSurface and internal inspection
Machine size (W x L x H) (mm)3,600 x 1,200 x 1,900 (Machine size may differ from the description depending on inspection items.)
Machine size (W x L x H) (in)141.7 x 47.2 x 74.8 (Machine size may differ from the description depending on inspection items.)
Inspection targetSilicon wafers (semiconductors, solar cells)
Max workpiece size (in)Φ11.8
Max workpiece size (mm)Φ300
Inspection itemO.D. and corner dimensions, chipping/chipping, cotton stains on front and back, through/non-through cracks, pinholes, foreign matter, plate thickness, waviness/warping, soakmark, resistivity/PN judgment, life time, et cetera. Inspection items not listed can be tailor-made.